Mfg Part Number: WS57C64F-70D | Alternate P/N: WS57C64F70D | NSN : 5962-01-319-0513 |
NIIN : 013190513 | CAGE Code : 66579 | Manufacturer: Waferscale Integration Inc |
Item Name : Microcircuit Memory | FSC : 5962 Microcircuits Electronic |
Thank you for choosing to rely on NSN 3Sixty for NSN part WS57C64F-70D and FSC 5962 Microcircuits Electronic under Microcircuit Memory under NIIN 013190513 with. You have reached our NSN RFQ Page where you can request quotes for our most top-requested NSN 5962-01-319-0513 components such as Microcircuit Memory manufactured by Waferscale Integration Inc with CAGE Code 66579. Some of the products we have in stock include part number WS57C64F-70D, and various others NSN parts, those of which have been thoroughly assessed for quality and functionality. At NSN 3Sixty, we distinguish ourselves from other distributors in our steadfast commitment to providing person-to-person communication at every stage of the procurement process, offering rapid turnaround times, unmatched cost savings, and exceptional customer service.
NSN 3Sixty receives praise for making quality the cornerstone of its operations, ensuring that our customers never have to worry about the integrity of our products. The NSN 5962-01-319-0513 products that we feature by Waferscale Integration Inc are paired alongside their corresponding CAGE Code 66579. Furthermore, the NSN items we carry are thoroughly assessed for reliability and authenticity. Get part WS57C64F-70D that suits your operations, we invite you to fill out and submit an RFQ form for your comparisons. For additional questions, you can call or email us directly; we are available 24/7x365!
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-319-0513 Item Description: Microcircuit Memory | 5962 | 013190513 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Ws57c64f-70d | 5 | 2 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
ABHP | OVERALL LENGTH | 1.280 INCHES MAXIMUM |
ABKW | OVERALL HEIGHT | 0.355 INCHES NOMINAL |
ABMK | OVERALL WIDTH | 0.620 INCHES MAXIMUM |
ADAQ | BODY LENGTH | 1.280 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.550 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.210 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | +0.0 TO 70.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQZP | INPUT CIRCUIT PATTERN | 11 INPUT |
CZEQ | TIME RATING PER CHACTERISTIC | 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CBBL | FEATURES PROVIDED | BIPOLAR AND BURN IN AND ERASABLE AND HIGH PERFORMANCE AND HIGH SPEED AND LOW POWER AND PROGRAMMABLE |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
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