Mfg Part Number: HS5058-1001 | Alternate P/N: HS50581001 | NSN : 5961-01-245-3669 |
NIIN : 012453669 | CAGE Code : 8V613 | Manufacturer: The Boeing Company |
Item Name : Semiconductor Devices Unitized | FSC : 5961 Semiconductor Devices and Associated Hardware |
Thank you for choosing to rely on NSN 3Sixty for NSN part HS5058-1001 and FSC 5961 Semiconductor Devices and Associated Hardware under Semiconductor Devices Unitized under NIIN 012453669 with. You have reached our NSN RFQ Page where you can request quotes for our most top-requested NSN 5961-01-245-3669 components such as Semiconductor Devices Unitized manufactured by The Boeing Company with CAGE Code 8V613. Some of the products we have in stock include part number HS5058-1001, and various others NSN parts, those of which have been thoroughly assessed for quality and functionality. At NSN 3Sixty, we distinguish ourselves from other distributors in our steadfast commitment to providing person-to-person communication at every stage of the procurement process, offering rapid turnaround times, unmatched cost savings, and exceptional customer service.
NSN 3Sixty receives praise for making quality the cornerstone of its operations, ensuring that our customers never have to worry about the integrity of our products. The NSN 5961-01-245-3669 products that we feature by The Boeing Company are paired alongside their corresponding CAGE Code 8V613. Furthermore, the NSN items we carry are thoroughly assessed for reliability and authenticity. Get part HS5058-1001 that suits your operations, we invite you to fill out and submit an RFQ form for your comparisons. For additional questions, you can call or email us directly; we are available 24/7x365!
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5961-01-245-3669 Item Description: Semiconductor Devices Unitized | 5961 | 012453669 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | ||||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Hs5058-1001 | 1 | 8 | E |
MRC | Criteria | Characteristic |
---|---|---|
ABBH | INCLOSURE MATERIAL | CERAMIC |
ABHP | OVERALL LENGTH | 0.785 INCHES MAXIMUM |
ABKW | OVERALL HEIGHT | 0.200 INCHES MAXIMUM |
ABMK | OVERALL WIDTH | 0.325 INCHES MAXIMUM |
ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | TO-116 |
ASKA | COMPONENT NAME AND QUANTITY | 4 TRANSISTOR |
AXGY | MOUNTING METHOD | PRESS FIT |
CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED CASE |
CTMZ | SEMICONDUCTOR MATERIAL | SILICON ALL TRANSISTOR |
CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | -40.0 MAXIMUM COLLECTOR TO EMITTER VOLTAGE, DC ALL TRANSISTOR AND -40.0 MAXIMUM COLLECTOR TO BASE VOLTAGE, DC ALL TRANSISTOR AND -5.0 MAXIMUM EMITTER TO BASE VOLTAGE, DC ALL TRANSISTOR |
CTQX | CURRENT RATING PER CHARACTERISTIC | -1.00 AMPERES SOURCE CUTOFF CURRENT MAXIMUM ALL TRANSISTOR |
CTRD | POWER RATING PER CHARACTERISTIC | 6.3 WATTS SMALL-SIGNAL INPUT POWER, COMMON-COLLECTOR ABSOLUTE ALL TRANSISTOR |
CTRK | TRANSFER RATIO | 20.0 MINIMUM STATIC FORWARD CURRENT TRANSFER RATIO, COMMON-EMITTER ALL TRANSISTOR |
CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 DEG CELSIUS AMBIENT AIR |
FEAT | SPECIAL FEATURES | ALL TRANSISTOR JUNCTION PATTERN ARRANGEMENT: PNP |
TTQY | TERMINAL TYPE AND QUANTITY | 14 UNINSULATED WIRE LEAD |
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