Mfg Part Number: 82S23 BFA | Alternate P/N: 82S23BFA | NSN : 5962-01-310-8692 |
NIIN : 013108692 | CAGE Code : 18324 | Manufacturer: Philips Semiconductors Inc |
Item Name : Microcircuit Memory | FSC : 5962 Microcircuits Electronic |
Thank you for choosing to rely on NSN 3Sixty for NSN part 82S23 BFA and FSC 5962 Microcircuits Electronic under Microcircuit Memory under NIIN 013108692 with. You have reached our NSN RFQ Page where you can request quotes for our most top-requested NSN 5962-01-310-8692 components such as Microcircuit Memory manufactured by Philips Semiconductors Inc with CAGE Code 18324. Some of the products we have in stock include part number 82S23 BFA, and various others NSN parts, those of which have been thoroughly assessed for quality and functionality. At NSN 3Sixty, we distinguish ourselves from other distributors in our steadfast commitment to providing person-to-person communication at every stage of the procurement process, offering rapid turnaround times, unmatched cost savings, and exceptional customer service.
NSN 3Sixty receives praise for making quality the cornerstone of its operations, ensuring that our customers never have to worry about the integrity of our products. The NSN 5962-01-310-8692 products that we feature by Philips Semiconductors Inc are paired alongside their corresponding CAGE Code 18324. Furthermore, the NSN items we carry are thoroughly assessed for reliability and authenticity. Get part 82S23 BFA that suits your operations, we invite you to fill out and submit an RFQ form for your comparisons. For additional questions, you can call or email us directly; we are available 24/7x365!
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-310-8692 Item Description: Microcircuit Memory | 5962 | 013108692 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
82s23 Bfa | 2 | 9 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.440 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.285 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 332.8 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
CQZP | INPUT CIRCUIT PATTERN | 6 INPUT |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | F-5 MIL-M-38510 |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
TTQY | TERMINAL TYPE AND QUANTITY | 16 FLAT LEADS |
ADAU | BODY HEIGHT | 0.085 INCHES MAXIMUM |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CBBL | FEATURES PROVIDED | MONOLITHIC AND W/OPEN COLLECTOR AND BIPOLAR AND PROGRAMMABLE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
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